Seco, Qualcomm unite to advance IIoT edge computing products

Seco, Qualcomm unite to advance IIoT edge computing products

Seco, an IoT and AI solution provider, has joined forces with Qualcomm to create edge computing solutions for the Industrial IoT (IIoT) sector.

The collaboration focuses on introducing edge computing products that leverage the processors developed by Qualcomm Technologies.

The partnership with Qualcomm is a chance for SECO to enhance its visibility and market reach, notes Massimo Mauri, CEO of Seco.

“Thanks to this collaboration, we will be able to offer increasingly cutting-edge hardware solutions and make them available to our customers, actually accelerating their digital evolution,” adds Mauri.

SECO has been named a design center partner by Qualcomm Technologies for IIoT. SECO will develop reference designs for off-the-shelf hardware solutions as part of the collaboration, specifically targeting OEM customers. The focus is on creating a system-on-module (SOM) and a modular single-board computer (SBC), which will be included in SECO’s standard edge computing solutions catalog.

According to Roberto Di Pietro, the VP of business development at Qualcomm Europe, the digital transformation of industries is driven by technological advancements, including connectivity, computing, on-device AI and cloud services.

“Combining our technology leadership and SECO’s expertise in hardware development will help OEM customers bring IoT products to market quicker and address new edge compute and AI use cases,” comments Di Pietro.

Qualcomm Technologies says it will support SECO in developing products, speeding up time to market. Specifically, the company will provide technical support for integrating Qualcomm components into SECO’s new products. In addition, Qualcomm will offer custom designs for customers to meet specific needs in different sectors.

Seco emphasizes that design flexibility is crucial in helping companies enhance device performance for IIoT applications. SECO says it offers end-to-end services as a comprehensive solution provider, guiding users in connecting to its IoT platform, CLEA. This, in turn, enables the integration of machine learning and AI capabilities into end-user devices.

Earlier this year, Seco launched Callisto, a COM Express Type 6 module powered by the 13th Gen Intel core processor family. Designed to deliver high-performance AI processing, Seco says that Callisto is perfect for industrial automation, robotics and edge computing applications.

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