UMC and partners targets edge AI with W2W 3D IC project launch
Semiconductor foundry, United Microelectronics Corporation (UMC) has initiated its W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday,…
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Semiconductor foundry, United Microelectronics Corporation (UMC) has initiated its W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday,…
The LoRa Alliance has announced that EchoStar Mobile, a provider of satellite communication solutions, has joined its Board of Directors….
Agriculture, as one of the world’s oldest and most critical industries, has always been at the forefront of innovation to…
According to a report by SNS Telecom & IT, spending on private 5G/4G cellular networks in the utilities sector is…
NTT Corporation, a global technology services company, has announced a partnership with Chunghwa Telecom to develop international network connectivity using…
Advantech, an industrial IoT provider, is set to expand its presence in the Indian market with investments in a new…
NVIDIA is collaborating with Hon Hai Technology Group (Foxconn) in a bid to boost AI capabilities across several areas. As…
Adlink Technologies Inc, an edge computing provider, recently announced its progress with strategic collaborations via its EdgeOpen platform. Adlink notes…
During the recent Capacity Europe event, Zenlayer, a distributed edge cloud provider, announced a strategic partnership with Mobily, the second-largest…
Carrier- and cloud-neutral hyperscale edge data centers provider Cologix and infrastructure owner CIM Group have jointly completed a 15 megawatt…