Biden administration invests $269M to boost edge computing capabilities in microelectronics sector
The Biden-Harris Administration announced $269 million in funding for microelectronics manufacturing and workforce development. This investment is part of the Microelectronics Commons (ME Commons) initiative, aimed at enhancing U.S. semiconductor capabilities.
The funding is sourced from the CHIPS and Science Act, which seeks to reduce reliance on foreign microelectronics. The ME Commons includes eight regional hubs, with a total of $2 billion allocated from FY23 to FY27.
The initiative focuses on advancing microelectronics technology and providing American workers with advanced skills.
“Microelectronics are critical to our goals of having a more reliable microelectronics supply and to deliver next-generation capabilities for our troops,” said Dr. Devanand Shenoy, executive director of the Microelectronics Commons and principal director for microelectronics in the Office of the Under Secretary of Defense for Research and Engineering. “These awards will also upskill America’s workforce, thus helping keep America both secure and prosperous.”
The $269 million is distributed across six technical areas, including quantum, secure edge computing, and artificial intelligence. The Department of Defense (DoD) will visit three hubs to discuss progress and highlight award recipients.
The initiative aims to foster partnerships, modernize research facilities, and enhance workforce development tailored to regional needs. Workforce development initiatives target education in microelectronics, especially in underutilized institutions like HBCUs and community colleges.
The project funding will benefit 28 states and Washington, D.C., promoting a robust microelectronics workforce. Last year, the Department of Defense announced and awarded just under $240 million to launch the eight Hubs.
Article Topics
AI | Biden administration | edge computing | funding | microelectronics | quantum computing
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