STMicro, eYs3D Microelectronics demonstrate 3D stereo-vision camera at CES 2023
STMicroelectronics, a semiconductor ICs manufacturer, has collaborated with eYs3D Microelectronics, a company that specializes in 3D sensing technology, to develop a 3D stereo-vision camera. This camera uses eYs3D Microelectronics’ video and depth cameras ICs and STMicro’s image sensor to allow it to efficiently track fast motion object tracking in AIoT applications and autonomous robots.
STMicroelectronics has reported that its proprietary image sensing technology offers high sensitivity and low crosstalk, which has enabled the company to expand its market footprint. In addition to advanced image sensing capabilities, the sensor device has a competitive price point with compact system size, making it suitable for use in advanced machine vision applications.
“The strong connection we have established with ST increases our confidence to develop new products that will lead the machine vision market,” said James Wang, chief strategy and sales officer, eYs3D Microelectronics.
The two reference designs (Ref-B6 and Ref-B3 active stereo vision video and depth cameras) use eYs3D’s computer vision processor and eSP876 stereo 3D depth-map chipset. All of this is tightly integrated with STMicroelectronics’ image sensor to provide enhanced near-infrared sensitivity. Both companies will be demonstrating the Ref-B6 depth camera for machine vision and robotics monitoring at CES 2023.
“While the reference designs showcased at CES are using monochromatic sensors, we can already foresee exciting enhancements and further use-cases using the RGB and RGB-IR versions of our sensors,” said David Maucotel, Business Line Manager at STMicroelectronics’ Imaging Sub-Group.
The two reference designs are compatible with Windows, Linux, and Android operating system environments. It also offers the user the option to select from various programming languages and wrapper APIs for added flexibility. The Ref-B6 stereo video camera has a 6-centimeter baseline and a wider depth field of view due to its advanced sensor hardware design.
“The collaboration with eYs3D Microelectronics, through their expertise in capture, perception understanding, and 3D-fusion, offers ST additional business opportunities, use cases, and ecosystems addressing demands for stereo vision in applications such as robots, home automation, home appliances, and many others,” said David Maucotel, Business Line Manager at ST’s Imaging Sub-Group.
Article Topics
chips | computer vision | edge AI | eYs3D Microelectronics | sensors | STMicro
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